Power chips are linked to external circuits through product packaging, and their efficiency depends upon the assistance of the product packaging. In high-power circumstances, power chips are generally packaged as power components. Chip interconnection describes the electrical connection on the top surface area of the chip, which is generally aluminum bonding cord in traditional modules. ^
Traditional power module plan cross-section
Today, commercial silicon carbide power components still mainly make use of the product packaging modern technology of this wire-bonded conventional silicon IGBT component. They encounter troubles such as big high-frequency parasitic criteria, not enough heat dissipation capacity, low-temperature resistance, and not enough insulation strength, which restrict using silicon carbide semiconductors. The screen of outstanding efficiency. In order to solve these issues and fully exploit the huge possible advantages of silicon carbide chips, lots of brand-new product packaging technologies and options for silicon carbide power components have actually arised in the last few years.
Silicon carbide power module bonding approach
(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)
Bonding products have actually created from gold cable bonding in 2001 to aluminum cable (tape) bonding in 2006, copper cord bonding in 2011, and Cu Clip bonding in 2016. Low-power tools have actually developed from gold cords to copper cables, and the driving pressure is expense decrease; high-power devices have actually developed from aluminum cables (strips) to Cu Clips, and the driving force is to boost product efficiency. The greater the power, the higher the needs.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a product packaging process that utilizes a solid copper bridge soldered to solder to attach chips and pins. Compared to conventional bonding product packaging techniques, Cu Clip modern technology has the adhering to advantages:
1. The connection between the chip and the pins is made of copper sheets, which, to a certain extent, replaces the typical wire bonding technique in between the chip and the pins. For that reason, an one-of-a-kind bundle resistance worth, higher existing flow, and better thermal conductivity can be obtained.
2. The lead pin welding location does not need to be silver-plated, which can fully conserve the price of silver plating and poor silver plating.
3. The product appearance is entirely regular with typical items and is primarily used in web servers, portable computers, batteries/drives, graphics cards, electric motors, power supplies, and other fields.
Cu Clip has two bonding approaches.
All copper sheet bonding technique
Both the Gate pad and the Resource pad are clip-based. This bonding approach is more expensive and complicated, however it can attain better Rdson and far better thermal impacts.
( copper strip)
Copper sheet plus cable bonding approach
The resource pad uses a Clip technique, and eviction makes use of a Wire method. This bonding approach is somewhat more affordable than the all-copper bonding technique, saving wafer area (suitable to extremely tiny gate areas). The process is easier than the all-copper bonding technique and can obtain better Rdson and much better thermal result.
Provider of Copper Strip
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